No Air Gun, No Soldering Iron Needed — Just Precision, Speed, and Safety
🔧 Key Features
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All-in-One Platform for Mobile Board Repairs
Supports motherboard layering, tinning, lamination, desoldering, glue removal, and screen bracket separation — all without using an air gun or traditional soldering iron. -
Fully Compatible with Android & IP Series
Works with IP7G to IP16PM and most Android phone models. Easily switch modules to suit different board layouts and repair scenarios. -
12 Replaceable Modules for Maximum Versatility
Modular design allows precise handling of a wide variety of iPhone models (from 7G to 16PM, A18 Pro) and Android motherboards. -
360° Rotating Buckle Rail Design
Secures boards of all shapes with adjustable positioning columns. Enhances operation speed and accuracy. -
Fast Heating & Intelligent Digital Temperature Control
Real-time temperature display with fast rise, uniform heat distribution, and adjustable temp range to match different solder melting points. -
Safe & User-Friendly Design
Features anti-slip silicone pads, hollow structure for heat dissipation, and quick-release module buckles for safe and convenient usage.
🔄 Applicable Scenarios
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Fingerprint repair
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CPU chip degumming
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Screen bracket separation
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Camera module support
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Face ID repair
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Android universal board handling
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New support for IP15/16 & A16/A18/A18 Pro boards
T12B-IP1: Universal CPU Debonding Platform – Suitable for various iPhone fingerprint & Face ID CPU glue removal tasks
T12B-IP2: Mainboard Heating Platform – for iPhone X / XS / XS Max / iPhone 8 fingerprint repair
T12B-IP3: Mainboard Heating Platform – for iPhone 11 / 11 Pro / 11 Pro Max
T12B-IP4: Mainboard Heating Platform – for iPhone 12 / 12 Pro / 12 Pro Max
T12B-IP5: Mainboard Heating Platform – for iPhone 13 / 13 Mini / 13 Pro / 13 Pro Max
T12B-IP6: Mainboard Heating Platform – for iPhone 14 / 14 Plus / 14 Pro / 14 Pro Max
T12B-IP7: Rear Camera Heating Platform – for iPhone X / XR / XS / XS Max / 12 Pro / 12 Pro Max / 13 / 13 Mini
T12B-IP8: Rear Camera Heating Platform – for iPhone 11 / 11 Pro / 11 Pro Max / 13 Pro / 13 Pro Max
T12B-IP9: Rear Camera Heating Platform – for iPhone 7 / 7 Plus / 8 / 8 Plus / 11 / 12 / 12 Mini / 14 / 14 Plus / 14 Pro / 14 Pro Max
T12B-IP10: Universal Heating Platform – for Android motherboard CPU glue removal
T12B-IP11: Mainboard Heating Platform – for iPhone 15 / 15 Plus / 15 Pro / 15 Pro Max
T12B-IP12: Mainboard Heating Platform – for iPhone 16 / 16 Plus / 16 Pro / 16 Pro Max
📦 Package Includes
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SS-T12B Host Unit × 1
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Heating Modules × 12 (IP1–IP12)
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Power Cord × 1
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Instruction Manual × 1
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Packing Box
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